Patent · US Active

Integration of a sensor system in a casing

US12157145B2 · kind B2 · utility

0Cited by

3References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Elian · Alteglofsheim, DE
Matthias Eberl · Schweinhub, DE
Fabian Merbeler · Munich, DE

Key dates

Filing date	Jul 15, 2022
Grant date	Dec 3, 2024
Priority date	—
Expiry date	Feb 5, 2043

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB06B2201/70
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.