Plating method, insoluble anode for plating, and plating apparatus
US12157951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Apr 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are a plating method, an insoluble anode and a plating apparatus capable of reducing consumption of an additive in a plating solution, when plating a substrate including a via or a hole for forming a through electrode. The plating method includes the steps of preparing a substrate including a via or a hole for forming a through electrode, preparing a plating solution tank that is divided, by a diaphragm, into an anode tank in which an insoluble anode is disposed and a cathode tank in which the substrate is disposed, and electroplating the substrate with an anode current density when plating the substrate in the plating solution tank being equal to or more than 0.4 ASD and equal to or less than 1.4 ASD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.