Dielectric-to-metal adhesion promotion material
US12159825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2021 |
| Grant date | Dec 3, 2024 |
| Priority date | — |
| Expiry date | Apr 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic substrate may be formed having at least one metal-to-dielectric adhesion promotion material layer therein. The electronic substrate may comprise a conductive metal trace, a dielectric material layer on the conductive metal trace, and the adhesion promotion material layer between the conductive metal trace and the dielectric material layer, wherein the adhesion promotion material layer comprises an organic adhesion material and a metal constituent dispersed within the organic adhesion material, wherein a metal within the metal constituent has a standard reduction potential greater than a standard reduction potential of the conductive metal trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.