Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same
US12162114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2021 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.