Process for the production of a molecular layer and electronic component comprising same
US12163223B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Oct 28, 2020 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jul 8, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2019/3408
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process is described for production of a molecular layer on a substrate using atomic layer deposition (ALD) techniques, for use in electronic components, in particular, in memory elements of the ReRAM type. Additionally, compounds for production of the molecular layer are disclosed, as well as memory elements containing the molecular layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.