Method of adjusting plating module
US12163244B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2021 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Mar 5, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.