Microbump cluster probing architecture for 2.5D and 3D dies
US12163982B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2022 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Dec 8, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure is directed to an inspection tool having a probe head with a probe card with a plurality of probes for performing testing, each of the probes being configured with a first end attached to the probe card and a second end for engaging microbumps coupled to a semiconductor die, the plurality of probes including a first set of probes having a first cross-sectional dimension, the first set of probes being arranged in a first set of locations on the probe card, and a second set of probes having a second cross-sectional dimension, the second set of probes being arranged in a second set of locations on the probe card, and a stage for holding the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.