Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip
US12164147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2021 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jan 31, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12102
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Techniques and mechanisms for optically coupling a photonic integrated circuit (PIC) chip to an optical fiber via a planar optical waveguide structure. In an embodiment, a PIC chip comprises integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) which are coupled to the integrated circuitry via the photonic waveguides. The PIC chip forms respective divergent lens surfaces of the IECs, which are each at a respective terminus of a corresponding one of the photonic waveguides. A planar optical waveguide structure, which is adjacent to the IECs, comprises a core which is optically coupled between the PIC chip and an array of optical fibers. In another embodiment, an edge of the PIC forms a stepped structure, wherein an upper portion of the stepped structure comprises the plurality of coplanar IECs, and a lower portion of the stepped structure extends past the plurality of coplanar IECs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.