Inventor · Chandler, AZ, US

Changhua Liu

14Patents

1h-index

40Co-inventors

46Inventor score

Filing activity: Mar 29, 2014 → Sep 30, 2022

Most-cited inventions

Patent	Title	Area	Cited by	Status
US11088103B2	First layer interconnect first on carrier approach for EMIB patch	Electricity	1	Active
US12164147B2	Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip	Physics	1	Active
US11837534B2	Substrate with variable height conductive and dielectric elements	Electricity	1	Active
US10403564B2	Dual-damascene zero-misalignment-via process for semiconductor packaging	Electricity	0	Active
US11644757B2	Method to achieve tilted patterning with a through resist thickness using projection optics	Performing Operations; Transporting	0	Active
US12345932B2	Die last and waveguide last architecture for silicon photonic packaging	Physics	0	Active
US12341117B2	Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates	Electricity	0	Active
US11264307B2	Dual-damascene zero-misalignment-via process for semiconductor packaging	Electricity	0	Active
US11586112B2	Method to achieve tilted patterning with a through resist thickness	Electricity	0	Active
US12298572B2	Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure	Physics	0	Active
US12354992B2	First layer interconnect first on carrier approach for EMIB patch	Electricity	0	Active
US10438812B2	Anisotropic etching systems and methods using a photochemically enhanced etchant	Electricity	0	Active
US10078204B2	Non-destructive 3-dimensional chemical imaging of photo-resist material	Physics	0	Active
US11506982B2	Prism-mask for angled patterning applications	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.