Patent · US Active

Systems and methods for performing sample lift-out for highly reactive materials

US12165832B2 · kind B2 · utility

0Cited by
2References
20Claims
0Family size

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Key dates

Filing dateDec 31, 2021
Grant dateDec 10, 2024
Priority date
Expiry dateDec 6, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/31749
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Methods and systems for performing sample lift-out and protective cap placement for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include preparing a nesting void in a support structure, translating at least a portion of a sample into the nesting void, and milling material from a region of the support structure that defines the nesting void. The material from the region of the support structure is milled such that at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial sectioning tomography on the sample, enhanced insertable backscatter detector (CBS) analysis on the sample, and electron backscatter diffraction (EBSD) analysis on the sample.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.