Adjustable wafer chuck
US12165898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2022 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Feb 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the present application are directed toward an adjustable wafer chuck. The adjustable wafer chuck is configured to hold a wafer. The adjustable wafer chuck comprises a base portion and a pad portion. The base portion comprises a plurality of adjustable base structures. The pad portion is disposed on a first side of the base portion. The pad portion comprises a plurality of contact pads disposed on the plurality of adjustable base structures. Each of the adjustable base structures are configured to move along a plane in a first direction and configured to move along the plane in a second direction that is opposite the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.