Screwless semiconductor processing chambers
US12165909B2 · kind B2 · utility
0Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2022 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Oct 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76856
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.