Radio frequency antennas and waveguides for communication between integrated circuit devices

US12165994B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Aleksandar Aleksov · Chandler, US
• Kristof Darmawikarta · Chandler, US
• Benjamin Duong · Chandler, US
• Telesphor Kamgaing · Chandler, US
• Miranda Ngan · Chandler, US
• Srinivas V. Pietambaram · Gilbert, US

Key dates

• Filing date: Sep 17, 2020
• Grant date: Dec 10, 2024
• Expiry date: Apr 10, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10098
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.