Benjamin Duong
8Patents
0h-index
28Co-inventors
34Inventor score
Filing activity: May 16, 2019 → Sep 23, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11948898B2 | Etch barrier for microelectronic packaging conductive structures | Electricity | 0 | Active |
| US12353070B2 | Glass interposer optical switching device and method | Physics | 0 | Active |
| US12345932B2 | Die last and waveguide last architecture for silicon photonic packaging | Physics | 0 | Active |
| US12249584B2 | Microelectronic assemblies having integrated magnetic core inductors | Electricity | 0 | Active |
| US12057252B2 | Electronic substrates having embedded inductors | Electricity | 0 | Active |
| US12349282B2 | Capacitors in through glass vias | Electricity | 0 | Active |
| US12159844B2 | Electronic substrates having embedded inductors | Electricity | 0 | Active |
| US12165994B2 | Radio frequency antennas and waveguides for communication between integrated circuit devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.