Cavity structure of bulk acoustic resonator, and manufacturing process
US12166469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2020 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jun 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/023
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A cavity structure of a bulk acoustic resonator and a manufacturing process. The cavity structure comprises a substrate and a cavity formed on the substrate, a support layer is arranged on the substrate to form the cavity in a surrounding manner, a release channel in communication with the cavity is formed above the substrate in a same layer with the cavity, and the release channel extends, in parallel to the substrate, in a peripheral area of the cavity. There is no need to manufacture a release hole, which simplifies the manufacturing process of the resonator, thereby avoiding weakening the performance of the resonator due to damage to the structure of the piezoelectric layer around the electrode layer when manufacturing the release hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.