Reducing line bending during metal fill process
US12173399B2 · kind B2 · utility
0Cited by
5References
21Claims
0Family size
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Key dates
| Filing date | Aug 18, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Aug 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of mitigating line bending during feature fill include deposition of an amorphous layer and/or an inhibition treatment during fill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.