Patent · US Active

Photonics package integration

US12174440B2 · kind B2 · utility

0Cited by
9References
20Claims
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Assignee

Inventors

Key dates

Filing dateJul 29, 2022
Grant dateDec 24, 2024
Priority date—
Expiry dateJul 29, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/4257
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.