Manifold designs for embedded liquid cooling in a package
US12176264B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2024 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | May 24, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package comprising a cooling system. The cooling system comprises a first substrate, a first semiconductor device located on a first region of the first substrate, a second semiconductor device located on a second region of the first substrate, a first cold plate attached to the first semiconductor device, a second cold plate attached to the second semiconductor device, and a manifold having a first chamber volume and a second chamber volume. The first chamber volume comprises a first inlet coupled to a first coolant line, a first outlet coupled to the first cold plate, and a second outlet coupled to the second cold plate. The second chamber volume comprises a third outlet coupled to a second coolant line, a second inlet coupled to the first cold plate, and a third inlet coupled to the second cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.