Ron Zhang
31Patents
6h-index
37Co-inventors
69Inventor score
Filing activity: Aug 30, 1999 → Dec 20, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10752075B1 | Systems and methods for determining vehicle characteristics | Performing Operations; Transporting | 105 | Active |
| US10611204B1 | Systems and methods for adapting tractive elements to a disabling event | Performing Operations; Transporting | 99 | Active |
| US11046142B2 | Systems and methods for adapting tractive elements to a disabling event | Performing Operations; Transporting | 38 | Active |
| US6243264A | SRAM heat sink assembly and method of assembling | Electricity | 15 | Expired |
| US6944025B2 | EMI shielding apparatus | Electricity | 12 | Expired |
| US9991231B2 | Stacked die integrated circuit | Electricity | 6 | Active |
| US12029004B2 | Data processing systems including optical communication modules | Emerging Cross-Sectional Technologies | 6 | Active |
| US12019289B2 | Communication systems having pluggable modules | Electricity | 4 | Active |
| US12066653B2 | Communication systems having optical power supplies | Electricity | 4 | Active |
| US12004318B2 | Data processing systems including optical communication modules | Emerging Cross-Sectional Technologies | 4 | Active |
| US9418924B2 | Stacked die integrated circuit | Electricity | 4 | Active |
| US12055766B2 | Communication systems having co-packaged optical modules | Physics | 3 | Active |
| US10882373B1 | High pressure gas spring controls for improved vehicle leveling | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US12250024B2 | Data processing systems including optical communication modules | Electricity | 2 | Active |
| US12405433B2 | Communication systems having pluggable modules | Electricity | 0 | Active |
| US11673444B2 | Systems and methods for adapting tractive elements to a disabling event | Performing Operations; Transporting | 0 | Active |
| US11982848B2 | Optical fiber-to-chip interconnection | Physics | 0 | Active |
| US11880564B2 | Regions with digital ink input | Physics | 0 | Active |
| US12176264B1 | Manifold designs for embedded liquid cooling in a package | Electricity | 0 | Active |
| US12412808B1 | Cold plate and manifold integration for high reliability | Electricity | 0 | Active |
| US11524543B2 | Systems and methods for determining vehicle characteristics | Performing Operations; Transporting | 0 | Active |
| US12341083B2 | Electronic device cooling structures bonded to semiconductor elements | Electricity | 0 | Active |
| US7571059B2 | Mechanism for determining an accelerated test specification for device elements | Physics | 0 | Active |
| US11752824B2 | High pressure gas spring controls for improved vehicle leveling | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US12368087B2 | Embedded cooling systems for advanced device packaging and methods of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.