Floating die package
US12176298B2 · kind B2 · utility
1Cited by
68References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | May 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.