Semiconductor device manufacturing device and manufacturing method
US12176317B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Feb 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device manufacturing device (10) comprises: a stage (16) on which a substrate (100) is loaded; a bonding head (14) that is disposed facing the stage (16) and that bonds a semiconductor chip (110) to the substrate (100); and a controller (18). The bonding head (14) includes: an attachment (33) that holds the semiconductor chip (110) by suctioning; and a heating part (31) that detachably holds the attachment (33) and that heats the attachment (33). The heating part (31) has a first heating area (32a) and a second heating area (32b) that surrounds the first heating area (32a) in the horizontal direction. The controller (18) controls the temperatures of the first heating area (32a) and the second heating area (32b) independently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.