Circuit board and manufacturing method thereof and electronic device
US12177964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jan 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.