Apparatus for polishing, processing system, and method of polishing
US12179312B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2021 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.