Sensor package and method of producing the sensor package
US12180066B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 12, 2021 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Jan 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.