Chip-to-chip interface of a multi-chip module (MCM)

US12182047B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Kameran Azadet · Morganville, US
• Wee Liew · San Jose, US
• Ramani Tatikola · Emmaus, US
• Edwin Thaller · Faak am See, AT
• Patrick Torta · Villach, AT
• Yu Wang · Troy, US
• Georg Weber · Langen (Hessen), DE
• James M. Yoder · Beaverton, US

Key dates

• Filing date: Dec 26, 2020
• Grant date: Dec 31, 2024
• Expiry date: Dec 26, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip-to-chip interface of a multi-chip module (MCM), including: bidirectional data links for transmitting data signals and a direction indicator bit, wherein the direction indicator bit switches a direction of the bidirectional data links in real-time; a clock link for transmitting a clock signal common to the bidirectional data links, wherein the data and clock links are comprised of conductive traces between the chips and laid out to be of substantially equal length; and a clock driver means having a digitally programmable clock signal delay.