Wee Liew
8Patents
5h-index
14Co-inventors
60Inventor score
Filing activity: May 1, 2001 → Dec 26, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6608376B1 | Integrated circuit package substrate with high density routing mechanism | Electricity | 38 | Expired |
| US6897555B1 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die | Electricity | 19 | Expired |
| US6525421B1 | Molded integrated circuit package | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6687133B1 | Ground plane on 2 layer PBGA | Electricity | 7 | Expired |
| US6512293B1 | Mechanically interlocking ball grid array packages and method of making | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6566167B1 | PBGA electrical noise isolation of signal traces | Electricity | 2 | Expired |
| US6825554B2 | PBGA electrical noise isolation of signal traces | Electricity | 2 | Expired |
| US12182047B2 | Chip-to-chip interface of a multi-chip module (MCM) | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.