Manufacturing method for manufacturing a package structure
US12183593B2 · kind B2 · utility
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12Claims
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Assignee
Inventors
Key dates
| Filing date | May 27, 2021 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | May 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.