High-temperature substrate support assembly with failure protection
US12185433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2023 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | May 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.