Polishing slurry composition
US12187919B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Dec 16, 2021 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jan 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A polishing slurry composition is provided. The polishing slurry composition includes polishing particles, a first polishing inhibitor containing a hydrophobic amino acid, and a second polishing inhibitor containing a cyclic polymer, and the first polishing inhibitor and the second polishing inhibitor are different.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.