Spin coater and semiconductor fabrication method using the same
US12189295B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Oct 3, 2022 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jan 25, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B1/24
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Systems and methods for semiconductor fabrication are described. A spin coater comprises a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing includes a lower housing including a solvent storage groove in which the organic solvent is stored, and an upper housing on the lower housing. The upper housing includes a nozzle insert hole on the solvent storage groove and receives the nozzle, and a gas supply hole connected to one side of the nozzle insert hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.