Microscopic non-destructive measurement method of microstructure linewidth based on translation difference
US12190495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30108
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure discloses a microscopic non-destructive measurement method of a microstructure linewidth based on a translation difference, based on a conventional microscopic imaging method, a high-precision displacement platform is used to move a to-be-measured sample, one microscopic image of the sample is acquired before and after the displacement separately, subtraction is performed on the two image to obtain a differential image, a light intensity distribution function of the differential image is derived, data fitting is performed on the differential image, and a high-precision sample linewidth measurement result is obtained by using the characteristic of a high differential pulse positioning resolution. The linewidth measurement method of the present disclosure retains the advantages of intuitiveness, quickness, and non-destructive measurement of the microscopic imaging method, breaks through the microscopic imaging diffraction limit, and reducing the impact of uneven illumination and imaging system noise, thereby improving the linewidth measurement accuracy
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.