Fingerprint sensor packages
US12190626B2 · kind B2 · utility
0Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Mar 9, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13312
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A sensor package includes at least one die, a fingerprint sensor, a mold material, and a land grid array. The fingerprint sensor is electrically coupled to the at least one die. The mold material encapsulates the at least one die. The land grid array layer is electrically coupled to the at least one die. The land grid array layer, the fingerprint sensor, and the mold material each include a common footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.