Bo Soon Chang
27Patents
9h-index
14Co-inventors
72Inventor score
Filing activity: Mar 6, 1998 → Mar 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8436460B1 | Multiple die paddle leadframe and semiconductor device package | Electricity | 26 | Active |
| US6215689A | Architecture, circuitry and method for configuring volatile and/or non-volatile memory for programmable logic applications | Electricity | 25 | Expired |
| US7939372B1 | Semiconductor device packaging using etched leadfingers | Electricity | 16 | Active |
| US6331728A | High reliability lead frame and packaging technology containing the same | Electricity | 13 | Expired |
| US6316821A | High density lead frames and methods for plastic injection molding | Electricity | 12 | Expired |
| US7031791B1 | Method and system for a reject management protocol within a back-end integrated circuit manufacturing process | Electricity | 12 | Expired |
| US6649447B1 | Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames | Electricity | 10 | Expired |
| US8017445B1 | Warpage-compensating die paddle design for high thermal-mismatched package construction | Electricity | 10 | Active |
| US7105377B1 | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process | Electricity | 9 | Expired |
| US6931298B1 | Integrated back-end integrated circuit manufacturing assembly | Electricity | 8 | Expired |
| US7818085B1 | System for controlling the processing of an integrated circuit chip assembly line | Electricity | 8 | Active |
| US6562272B1 | Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages | Performing Operations; Transporting | 8 | Expired |
| US6730545B1 | Method of performing back-end manufacturing of an integrated circuit device | Electricity | 7 | Expired |
| US6169322A | Die attach pad adapted to reduce delamination stress and method of using same | Electricity | 5 | Expired |
| US7391104B1 | Non-stick detection method and mechanism for array molded laminate packages | Electricity | 5 | Expired |
| US7045387B1 | Method of performing back-end manufacturing of an integrated circuit device | Electricity | 5 | Expired |
| US6576491B1 | Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame | Electricity | 5 | Expired |
| US6853202B1 | Non-stick detection method and mechanism for array molded laminate packages | Electricity | 5 | Expired |
| US6901984B1 | Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol | Electricity | 4 | Expired |
| US6730532B1 | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7939371B1 | Flip-flop semiconductor device packaging using an interposer | Electricity | 2 | Active |
| US7698015B1 | Integrated back-end integrated circuit manufacturing assembly | Electricity | 2 | Expired |
| US9263398B1 | Semiconductor packaging identifier | Electricity | 1 | Active |
| US7608914B1 | Integrated circuit package with electrically isolated leads | Electricity | 1 | Active |
| US12190626B2 | Fingerprint sensor packages | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.