Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US12191234B2 · kind B2 · utility
0Cited by
57References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Aug 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B80/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a top portion and a bottom portion horizontally adjacent to the top portion. The top portion comprises upper cavity dividers extending downwardly to define upper cavity volumes. The bottom portion comprises lower cavity dividers extending upwardly to define lower cavity volumes. The upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.