Inventor · San Jose, CA, US

Kyong-Mo Bang

27Patents
6h-index
22Co-inventors
69Inventor score

Filing activity: Aug 13, 2003 → Jul 25, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7294928B2 Components, methods and assemblies for stacked packages Electricity 140 Expired
US8680684B2 Stackable microelectronic package structures Electricity 87 Active
US7246431B2 Methods of making microelectronic packages including folded substrates Emerging Cross-Sectional Technologies 86 Expired
US7053485B2 Microelectronic packages with self-aligning features Electricity 76 Expired
US9349707B1 Contact arrangements for stackable microelectronic package structures with multiple ranks Electricity 23 Active
US9484080B1 High-bandwidth memory application with controlled impedance loading Electricity 8 Active
US8980693B2 Stackable microelectronic package structures Electricity 4 Active
US7935569B2 Components, methods and assemblies for stacked packages Electricity 3 Active
US9425167B2 Stackable microelectronic package structures Electricity 3 Active
US9337170B1 Contact arrangements for stackable microelectronic package structures Electricity 3 Active
US9543277B1 Wafer level packages with mechanically decoupled fan-in and fan-out areas Electricity 2 Active
US9847238B2 Fan-out wafer-level packaging using metal foil lamination Electricity 2 Active
US10566310B2 Microelectronic packages having stacked die and wire bond interconnects Electricity 1 Active
US9281296B2 Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design Electricity 1 Active
US9646946B2 Fan-out wafer-level packaging using metal foil lamination Electricity 1 Active
US9679613B1 TFD I/O partition for high-speed, high-density applications Electricity 1 Active
US10008469B2 Wafer-level packaging using wire bond wires in place of a redistribution layer Electricity 1 Active
US12322677B1 Fluid channel geometry optimizations to improve cooling efficiency Electricity 0 Active
US10468380B2 Stackable microelectronic package structures Electricity 0 Active
US9928883B2 TFD I/O partition for high-speed, high-density applications Electricity 0 Active
US9343398B2 BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail Electricity 0 Active
US12341083B2 Electronic device cooling structures bonded to semiconductor elements Electricity 0 Active
US12191234B2 Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same Electricity 0 Active
US9911717B2 Stackable microelectronic package structures Electricity 0 Active
US10026467B2 High-bandwidth memory application with controlled impedance loading Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.