Package structure and method for fabricating the same
US12191262B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B61/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, a first magnetic field shielding, and a molding. The semiconductor chip comprises a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad, and a third surface connecting the first surface and the second surface. The first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective. The molding surrounding the mounting pad and in direct contact with the mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.