Patent · US Active

Superstrate and a method of using the same

US12195382B2 · kind B2 · utility

0Cited by

23References

20Claims

0Family size

Assignee

Canon Kabushiki Kaisha · JP

Inventors

Steven C. Shackleton · Austin, US
Niyaz Khusnatdinov · Round Rock, US

Key dates

Filing date	Dec 1, 2021
Grant date	Jan 14, 2025
Priority date	—
Expiry date	Mar 6, 2043

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC03C2218/355
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A superstrate for forming a planarization layer on a substrate can include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer can coat the chamfered edge. In another embodiment, an opaque layer can coat the chamfered edge and a portion of the second surface. The superstrate can be used for more planarization or other processing sequences without causing extrusion defects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.