Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer
US12197007B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Aug 9, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | May 18, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12188
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described herein are stacked photonic integrated circuit (PIC) assemblies that include multiple layers of waveguides. The waveguides are formed of substantially monocrystalline materials, which cannot be repeatedly deposited. Layers of monocrystalline material are fabricated and repeatedly transferred onto the PIC structure using a layer transfer process, which involves bonding a monocrystalline material using a non-monocrystalline bonding material. Layers of isolation materials are also deposited or layer transferred onto the PIC assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.