Inventor · Portland, OR, US

Wilfred Gomes

48Patents
4h-index
76Co-inventors
58Inventor score

Filing activity: Jul 2, 2016 → Mar 25, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US11018264B1 Three-dimensional nanoribbon-based logic Electricity 10 Active
US11087832B1 Three-dimensional nanoribbon-based static random-access memory Electricity 7 Active
US11239238B2 Thin film transistor based memory cells on both sides of a layer of logic devices Electricity 6 Active
US11257822B2 Three-dimensional nanoribbon-based dynamic random-access memory Electricity 5 Active
US11024601B2 Hyperchip Electricity 3 Active
US11335686B2 Transistors with back-side contacts to create three dimensional memory and logic Electricity 2 Active
US11056492B1 Dense memory arrays utilizing access transistors with back-side contacts Electricity 2 Active
US11387198B2 Device, system and method for providing inductor structures Electricity 2 Active
US10784204B2 Rlink—die to die channel interconnect configurations to improve signaling Electricity 2 Active
US10685947B2 Distributed semiconductor die and package architecture Electricity 1 Active
US11373987B2 Device, method and system for providing a stacked arrangement of integrated circuit dies Emerging Cross-Sectional Technologies 1 Active
US11824041B2 Hyperchip Electricity 1 Active
US11894359B2 Distributed semiconductor die and package architecture Electricity 1 Active
US11139300B2 Three-dimensional memory arrays with layer selector transistors Electricity 1 Active
US11257804B2 Distributed semiconductor die and package architecture Electricity 1 Active
US12406956B2 Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers Electricity 0 Active
US12400997B2 Hybrid manufacturing with modified via-last process Electricity 0 Active
US12432897B2 Cooling approaches for stitched dies Electricity 0 Active
US11756886B2 Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures Electricity 0 Active
US12074138B2 Hyperchip Electricity 0 Active
US12197007B2 Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer Physics 0 Active
US12396155B2 Backend memory with air gaps in upper metal layers Electricity 0 Active
US12310032B2 Stacked backend memory with resistive switching devices Electricity 0 Active
US12058849B2 Three-dimensional nanoribbon-based dynamic random-access memory Electricity 0 Active
US12176147B2 Three-dimensional capacitors with double metal electrodes Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.