Semiconductor process apparatus and process chamber
US12198913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Oct 21, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process chamber includes a chamber body, a base, and a magnetic conductive device. The base is arranged in the chamber body. The base includes a carrier surface configured to carry a wafer. The magnetic conductive device includes a magnet structure and a magnetic conductive structure made of a soft magnetic material. The magnet structure is arranged around the base and configured to provide a magnetic field above the base. The magnetic conductive structure is arranged under the carrier surface of the base, has a preset distance from the carrier surface of the base, and is configured to guide the distribution of the magnetic field lines of the magnetic field above the base to cause the intensity of the magnetic field to be evenly distributed above the base and the directions of the magnetic field lines to be consistent at different positions of the corresponding carrier surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.