Substrate handling in a modular polishing system with single substrate cleaning chambers
US12198944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Jan 7, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in/dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in/dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.