Intelligent customizable wet processing system
US12198946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Mar 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6704
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of wet processing systems and methods for uniform wet processing are disclosed. A method described in the present disclosure includes measuring one or more wafer characteristics of a wafer using a plurality of detectors and determining a wafer profile of the wafer based on the measured one or more wafer characteristics. The method also includes setting first and second sets of wet processing parameters of a wet processing system for respective first and second wafer regions based on the wafer profile, where a value of at least one wet processing parameter is different between the first and second sets of wet processing parameters. The method further includes performing wet processing on the wafer by dispensing one or more chemicals onto the first and second wafer regions according to the respective first and second sets of wet processing parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.