Method of assembling waterproof structure
US12199393B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 7, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Apr 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling a waterproof structure includes the following operations. Connect a first input/output connector of a circuit board to a first positioning fixture. A first elastic adhesive is combined with a first rigid board. An end of the first positioning fixture away from the first input/output connector is passed out of the first rigid board, and the first input/output connector and the first elastic adhesive are separated on two sides of the first rigid board. The circuit board is arranged in the casing, wherein the first positioning fixture is inserted from the first input/output opening on the first wall inside the casing, so that the first elastic adhesive adheres the first rigid board to the first wall of the casing, and the first elastic adhesive fills a spacing between the first positioning fixture and the first input/output opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.