Package device
US12200857B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2023 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Sep 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4682
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.