Material deposition apparatus, method of depositing material on a substrate, and material deposition system
US12203164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Apr 11, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A material deposition apparatus for depositing an evaporated material onto a substrate is provided. The material deposition apparatus includes a processing drum having a cooler configured to control a substrate temperature during processing of a substrate on the processing drum; a roller guiding the substrate towards the processing drum; a first heater assembly positioned to heat the substrate in a free-span area between the roller and the processing drum; a second heater assembly positioned to heat the substrate while being supported on the processing drum; at least one deposition source provided along a substrate transport path downstream of the second heater assembly; a substrate speed sensor providing a speed signal correlating with a substrate transportation speed; and a controller having an input for the speed signal configured to control at least the first heater assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.