Method and system for detecting anomalies in a semiconductor processing system

US12203828B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Ryan T. DOWNEY · San Jose, US
• Hemant P. Mungekar · Campbell, US
• James L'HEUREUX · Santa Clara, US
• Andreas Neuber · Stuttgart, DE
• Michael W. Johnson · Rogers, US
• Joseph A. VAN GOMPEL · Austin, US
• Gino Gerardo CRISPIERI · Austin, US
• Tony H. Tong · San Jose, US
• Maxime Cayer · Chandler, US
• John L. KOENIG · Cedar Park, US
• Mike M. HUANG · Hsinchu, TW

Key dates

• Filing date: Apr 26, 2021
• Grant date: Jan 21, 2025
• Expiry date: Apr 26, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G06Q50/04
• WIPO field: IT methods for management
• WIPO sector: Electrical engineering

Abstract

The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.