Lithography film stack and lithography method
US12204247B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Feb 9, 2023 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Sep 23, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lithography film stack applied to an immersion lithography process includes a photoresist, a wavelength adjusting layer and a top coating layer. The photoresist is disposed on a substrate. The wavelength adjusting layer is disposed on the photoresist. The top coating layer is disposed on the wavelength adjusting layer. A refractive index of the wavelength adjusting layer is greater than a refractive index of the top coating layer and a refractive index of an immersion fluid of the immersion lithography process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.