Non-volatile memory die with bit-flip object insertion
US12205252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Jul 20, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T7/90
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Bit-flip object insertion techniques are provided for use with a non-volatile memory (NVM) wherein an object is inserted into a background image by flipping or inverting one or more bits within the pixels of the background image that correspond to the shape and insertion location of an object being inserted. In an illustrative example, pixels within the background image that correspond to the shape and insertion location of the object are XORed with binary 1s. This flips the bits of those pixels to change the color (hue) and/or intensity (brightness) of the pixels so the object appears in the background image. In other examples, only the most significant bits of pixels in the background image are inverted (flipped). Exemplary latch-based procedures are described herein for high-speed processing on an NVM die. Multiple plane NVM die implementations are also described for massive processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.