Plasma processing apparatus and plasma processing method
US12205801B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2021 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Aug 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/24564
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a plasma processing apparatus, a controller specifies a time point when a current starts to flow between an edge ring and a DC power supply after beginning an application of a negative DC voltage to the edge ring from the DC power supply. The controller specifies, from a voltage measurement value indicating a voltage of the edge ring at the time point, an estimate of a self-bias voltage of the edge ring generated by a supply of a radio frequency power. The controller sets a sum of an absolute value of the estimate of the self-bias voltage and a set value as an absolute value of the negative DC voltage to be applied to the edge ring by the DC power supply.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.