Hatching ground under a pad in a printed circuit board
US12207391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Jan 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system includes a printed circuit board. The printed circuit board includes first and second pads of a first differential pair, a hatched ground, and first and second traces of a second differential pair. The first and second pads of the first differential pair are routed a surface of the printed circuit board. The hatched ground routed within a first layer of the printed circuit board. The first and second traces of the second differential pair are routed below the first and second pads and the hatched ground within a second layer of the printed circuit board. The hatched ground dampens crosstalk between signals on the traces and signals on the differential pair pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.